| Stosowanie: | Sheet |
|---|---|
| Grubość: | 0.010" (0.254mm) |
| Opór cieplny: | - |
| Przewodność cieplna: | 2.0 W/m-K |
| Kształt: | Square |
| Seria: | PC93 |
| Zarys: | 5.00mm x 5.00mm |
| Materiał: | Non-Silicone |
| Kolor: | Gray |
| Podłoże, Carrier: | - |
| Spoiwo: | - |
PC93-5-5-5
THERMAL PAD 5X5X5MM
PC93-5-5-1
THERMAL PAD 5X5X1MM
PC93-5-5-3
THERMAL PAD 5X5X3MM
PC93-320-320-2.0-0
NON SILICONE TIM 320X320X2MM
PC93-320-320-5.0-0
NON SILICONE TIM 320X320X5MM
PC93-5-5-2
THERMAL PAD 5X5X2MM
PC93-5-5-3-1A
THERMAL PAD 5X5X3MM 1SIDE AD
PC93-320-320-1.0-0
PC93 SHEET 320X320X1MM
PC93-320-320-0.25-0
NON SILICONE 320X320X0.25MM
PC93-320-320-3.0-0
NON SILICONE TIM 320X320X3MM
8N4QV01EG-0087CDI
IC OSC VCXO QD FREQ 10CLCC
8N4QV01EG-0140CDI
IC OSC VCXO QD FREQ 10CLCC
8N4QV01EG-1121CDI
IC OSC VCXO QD FREQ 10CLCC
8N4QV01KG-1154CDI
IC OSC VCXO QD FREQ 10CLCC
DS1394U-33+T&R
IC RTC CLK/CALENDAR SPI 10-MSOP
NBVSPA027LN1TAG
IC OSC VCXO 148.5MHZ 6CLCC
MCP7940M-I/P
IC RTC CLK/CALENDAR I2C 8DIP
DS12885+
IC RTC CLK/CALENDAR PAR 24-DIP
X1288S16I-4.5AT1
IC RTC CLK/CALENDAR I2C 16-SOIC
TS556ID
IC OSC TIMER DUAL 2.7MHZ 14-SOIC
